Chief executive officer, SK hynix
Appears in 7 stories
Last updated Nov 2, 2026
Leading SK hynix through record earnings; first earnings call appearance in six years
SK hynix posted a record quarterly operating profit of 83.3 trillion won (about US$62.5 billion) for July through September, up sevenfold from a year earlier and above analyst expectations. Revenue crossed 100 trillion won for the first time, at 104.6 trillion won.
Updated Nov 2
On Oct 28 said the Solidigm IPO review was discontinued and that funding would match valuation; no US funding route announced.
SK Hynix dropped the planned US listing of its Solidigm memory unit, a sale that could have raised $15 billion at a $150 billion valuation. It halted the review on October 23, citing market conditions and share prices. On October 28 it said the review was discontinued. South Korean regulators had said the listing would fall under rules meant to protect parent-company shareholders.
Updated Nov 1
As of August 2026: Co-leading the HBF standard and targeting the next-generation NAND market
AI chips are starving for memory. On August 4, 2026, SK hynix and Sandisk published the first open technical standard for a possible fix: High Bandwidth Flash, or HBF.
Updated Aug 4
As of July 2026: Led the company's US listing
SK Hynix rang the Nasdaq opening bell on July 10 and raised about $26.5 billion. No foreign company has ever raised more in a US share sale.
Updated Jul 10
As of June 2026: Leading SK hynix through the HBM4 ramp and HBM4E qualification
Modern AI chips can crunch numbers faster than memory can feed them data. On June 18, 2026, SK hynix said it shipped samples of HBM4E, a stacked memory chip built to narrow that gap, to major customers.
Updated Jun 18
As of May 2026: Leading company through record-breaking performance
South Korea's benchmark KOSPI stock index crossed 6,000 points for the first time on February 25, 2026. It completed its climb from 5,000 to 6,000 in just 34 trading days, the fastest thousand-point advance in the index's history.
Updated May 29
As of May 2026: Leading company through HBM expansion
For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI.
Updated May 20
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