High-bandwidth memory standardized (2013–2015)
SK hynix and AMD co-developed high-bandwidth memory (HBM), stacking DRAM chips next to a processor for far faster data flow. JEDEC published the standard in 2013. The first product shipped in AMD's Fiji graphics chip in 2015.
HBM was expensive and niche at first, used mainly in high-end graphics and specialized computing.
HBM became the default memory for AI accelerators, and SK hynix's early lead turned into a dominant, high-margin business.
HBF follows the same playbook: a memory maker and partners set an open standard early, hoping to own the next AI-memory tier.
