Assistant Professor, Carnegie Mellon University
Appears in 1 story
Senior author on the 3D chip paper
A team from Stanford, Carnegie Mellon, Penn, and MIT just built something chip makers have chased for decades: a true 3D chip manufactured in a U.S. commercial foundry that stacks memory directly on top of computing logic. Presented at December's IEEE electron devices conference, the prototype beats conventional flat chips by 4x in tests and could deliver 1,000x energy efficiency gains in future generations. The trick? Carbon nanotube transistors and resistive RAM built at temperatures low enough to avoid frying the circuits below, creating vertical data highways where today's chips force information to crawl across horizontal distances.
Updated Dec 27, 2025
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