Micron Technology

Micron halts Taoyuan plant as union talks stall

Suspended construction of its Taoyuan Fab 11E plant in early November after talks with the Taoyuan union stalled; says current Taiwan production lines are operating normally and talks continued November 6

Micron has suspended construction of Fab 11E, its new Taoyuan memory plant, after talks with the Taoyuan union over profit-sharing stalled. The company says its existing Taiwan production lines are running normally.

Updated 1 hour ago

Singapore's economy grows 5.4% as AI-driven chip boom extends

Money Moves

Building a new high-bandwidth memory advanced packaging facility in Singapore

Singapore's economy expanded 5.4% in the third quarter of 2026, beating forecasts and extending a boom driven by demand for the semiconductors that power artificial-intelligence systems. Growth eased from 6.2% in the previous quarter but remains the strongest of any major advanced economy except Taiwan.

Updated Oct 31

German court grants YMTC injunctions against Micron in NAND patent fight

Rule Changes

As of September 2026: Defendant and appellant

A German court on September 18 ordered Micron to stop selling certain 3D NAND memory products in Germany. The ruling, over two utility-model patents owned by Chinese chipmaker Yangtze Memory Technologies (YMTC), is the first substantive win in a three-year patent war spanning five jurisdictions.

Updated Sep 29

Trump accounts launch: America's first universal child investment program

Rule Changes

As of July 2026: Committed $250 million — largest single corporate pledge to Trump Accounts

The program launched July 4, 2026, opening for contributions on America's 250th birthday. Treasury deposited $1,000 into 1.4 million eligible accounts, committing $1.4 billion in total; 6 million children are now enrolled.

Updated Jul 7

SK hynix ships first 12-layer HBM4E samples for AI systems

New Capabilities

As of June 2026: Third supplier; smaller share of Nvidia orders

Modern AI chips can crunch numbers faster than memory can feed them data. On June 18, 2026, SK hynix said it shipped samples of HBM4E, a stacked memory chip built to narrow that gap, to major customers.

Updated Jun 18

The packaging pivot: why AI's real bottleneck isn't chips—it's putting them together

Built World

As of May 2026: Third-place HBM competitor with aggressive expansion plans

For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI.

Updated May 20